Modify upstream thermal framework to work well on non-ACPI platforms

Meta:
Headline: Fix the thermal framework to be more useful on ARM platforms
Acceptance: Samsung boards boot correctly, the drivers function correctly and pass thermal tests.
Roadmap id: PMWG2011-THERMAL-MANAGEMENT

[amitdanielk] Test that temperature is reduced in production using the current solution-done on origen board: DONE
[amitdanielk] Added and posted the patch for a new trip type needed for cooling devices like cpufreq: DONE
[amitdanielk] Adding a generic processor cooling devices(non ACPI based, for ACPI already exists): DONE

moved to https://blueprints.launchpad.net/linaro-power-kernel/+spec/thermal-framework-upstream-changes-for-non-acpi-platforms-2012-01
Write a cpufreq cooling device that caps the frequency: TODO
Extend OMAP hwmon driver to register as a sensor with thermal framework: TODO
Work with TI Landing team to test thermal management solution on OMAP: TODO
Remove ACPI'isms and send to mainline(this workitem to be broken into smaller workitem): INPROGRESS
Some modifications found after review like make the exynos layer expose registration api's and make it instance based which will make multiple sensor registration possible: INPROGRESS.
Use the temperature information in thermal layer to generate some useful information like temperature drop per trip type : TODO