free from pads and solder-paste

Registered by Nicholas Savenlid

if you look at this footprint for example:
http://www.mouser.com/ds/2/311/LT%20QH9G%20-%20CHIPLED%200402-770020.pdf

it needs free-form shape of the solder-paste layer.

i suggest a possibility to dram both pads and solder-paste in free-form
also for solder paste layer an option to provide stencil thickness
sometimes you need stepped stencils where thickness vary
could be specified on footprint level also, maybe better

Blueprint information

Status:
Not started
Approver:
None
Priority:
Undefined
Drafter:
Nicholas Savenlid
Direction:
Needs approval
Assignee:
None
Definition:
New
Series goal:
None
Implementation:
Unknown
Milestone target:
None

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